| T O P I C R E V I E W |
| benaknoun |
Posted - 02/09/2012 : 14:13:21
Hi
I just bought this air nozzle:
http://www.mcumall.com/comersus/store/comersus_viewItem.asp?idProduct=4452
And this solder flux kit:
http://www.mcumall.com/comersus/store/comersus_viewItem.asp?idProduct=4446
I have a couple of questions please, sorry i'm new to this..
1-I used the air nozzle today to desolder a SOIC8 chip, but it took longer than when using a round 3 mm air nozzle, is this normal?
in fact, i could not desolder the chip with this nozzle, i had to use the round 3 mm nozzle.
2- with the essential pack, how do i use the solder paste and the flux, does anyone have a video for me to watch please?
with the SOIC8 i don't use anything, apart from solder, but i know with other chip i have to use flux, but what do i need the paste for?
Thanks in advance
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| 16 L A T E S T R E P L I E S (Newest First) |
| ZLM |
Posted - 04/27/2012 : 00:05:09
Sorry, my 5 minutes is a mistake. It should less than 1 minute. 5 minutes should remove more than 5 TSOP56. :) |
| Bad_Ad84 |
Posted - 04/26/2012 : 23:14:40
Takes about 20 seconds to remove a TSOP48/56 |
| benaknoun |
Posted - 04/26/2012 : 15:18:30
quote:
Originally posted by ZLM
I do not use any nozzle on TSOP56. 350 degree C and about 1~2" distance will work. 350 degree C will not harm the chip if you finish it with in 5 minutes.
I think to finish a TSOP56 within 5 minutes is a record ! |
| ZLM |
Posted - 02/26/2012 : 15:49:28
I do not use any nozzle on TSOP56. 350 degree C and about 1~2" distance will work. 350 degree C will not harm the chip if you finish it with in 5 minutes. |
| benaknoun |
Posted - 02/26/2012 : 15:01:15
Hi
I am using your recommended settings which are 350 degrees and 80 air pressure which I found on the tutorial video
I have tried also to desolder a tsop56 flash with the TSOP air nozzle and had no luck
I've had to use again the 3mm round nozzle
I think I should pre-heat the board first using preheating stations
What do you think?
Thanks again for your help
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| ZLM |
Posted - 02/25/2012 : 21:18:27
Yes. you can reduce the distance. The correct way is testing with different air temperature and air volume, untill the chip can be easily removed. |
| benaknoun |
Posted - 02/24/2012 : 06:53:40
Hi
It seems that the photo has now been uploaded
Strange because it always takes about 3 days for the photo to show on forum, anyway,
Can you answer my question about this nozzle, should i reduce the distance between the air outlet ports?
I feel that the hot air is not falling directly on the chip pins
Thanks |
| ZLM |
Posted - 02/23/2012 : 00:31:07
do not include SPACE and special char in the file name. Shorter, the better. |
| benaknoun |
Posted - 02/20/2012 : 07:13:50
 |
| benaknoun |
Posted - 02/20/2012 : 06:05:16
I have resized the picture to smallest size and still not showing on forum, i have always had problems loading photos on here !! |
| benaknoun |
Posted - 02/15/2012 : 17:13:36
Hi ZLM
I was looking at the nozzle, and i was thinking that maybe the distance between the outlet ports is too large? which means the heat isn't going on the pins, what do you think?
Look at this photo
Thanks
Image Insert:
65.74 KB |
| benaknoun |
Posted - 02/15/2012 : 11:09:20
Hi
I have tried again tonight, held the nozzle about 1cm away from the chip pins, for about 3 or 5 minutes and NOTHING !! the chip will not desolder.
Reinstalled the other round 3mm nozzle and the chip desoldered in 30 Seconds !!
Either the nozzle i bought is **** or something is wrong !!
I have a feeling the nozzle is not right ! |
| ZLM |
Posted - 02/14/2012 : 23:54:26
1. nozzel is used to blow the hot air only on the chip pins, not the body. So, it will not burn the chip.
2. the solder mask is used to place the solder paste on the PCB. It is similar to silk screen printing. IT will printing the solder paste on the PCB. Then the SMD chip will be able to stuck on the solder paste. |
| benaknoun |
Posted - 02/14/2012 : 17:04:05
Hello
No answers to my previous question ?
Thanks |
| benaknoun |
Posted - 02/10/2012 : 05:01:41
quote:
Originally posted by ZLM
1. it is normal. Adjust the distance between nozzle and the chip will adapte the size.
2. the solder paste is used when you have soldering mask with your PCB. If you do not have mask, then you can put some past on the soldering pads, the component pins should stick on the paste. Using the hot air to heat the paste untill it is melted.
Thanks ZLM
1- Do you mean have the nozzle much closer to the chip pins? is there no risk or burning the chip?
2- what is mask? do you mean solder on the pads?
Thanks again |
| ZLM |
Posted - 02/09/2012 : 21:49:48
1. it is normal. Adjust the distance between nozzle and the chip will adapte the size.
2. the solder paste is used when you have soldering mask with your PCB. If you do not have mask, then you can put some past on the soldering pads, the component pins should stick on the paste. Using the hot air to heat the paste untill it is melted. |
