SuperBOT-I is automated IC programming equipment;which is cost-effective, designed for manufacturing large-scale electronics. Itdoes not only improve the production efficiency greatly, but also eliminateshuman errors during IC programming process. Device Transmission system useshigh-speed and reliable design.
The performance of this equipment, both mechanical systems and programmingsystem have reached the world's top level, yet the price of the equipment hasbeen attracting many domestic firms' budgets, since it is highlycost-effective.
Features
The largest device support in the industry: Supports over 65,746 IC devices from 218 manufacturers and continuing
Uses Industrial Personal Computer (with control card inside)
Carries servo system and vision system mode to locate fast and accurately and finish chip capture, placement, programming, and packaging automatically instead of traditional manual operation.
Internal programmers are 4 SuperPro 5000 modules, which are latest, high-speed and intelligent universal programmers from Xeltek. Each module can burn chips independently, so its efficiency is much higher than parallel-production programmers.
Its advantages includes:
Modularizing design of system
switching time
High throughput (1400 devices per hour)
Cost effective
IC packaging supports standard tray and Tape Reel, Tube input and output.
Motion
Throughput Up to 1400 UPH (units per hour) handler index time with zeroprogramming time for SuperBOT Content High performance control card & servo drive system. Resolution X axis: (+/-)0.02mm; Y axis:(+/-)0.02mm; Z axis: (+/-)0.05mm. Max. stroke X axis: 500 mm; Y axis: 380mm; Zaxis:60mm. Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels. Vision resolution 0.1mm. Process time per view ~0.5sec.
Built in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone UniversalDevice Programming units; SuperPro5000
I/O Devices
Tray : It is the standard I/O device of themachine. Users provide the type and three special positions of the tray, andthe system can calculate the position of each chip on the tray. Auto tray :This device includes tray in andtray out. Users can put 10 trays into the device. When the machine is running,users can add trays or take out trays without stopping the machine. Tape-in Device : An input device for tapes withIC packaging. It must be modified for custom IC size. Tape-out Device :An output device for tapeswith IC packaging. It handles tape widths of 12mm to 40mm. The tape can beair-pressed or heat-sealed. Tube-In Device Tube-Out Device
Assistant Control
Built-in Control : PC-based control withWindows XP. Display : LCD monitor. Data entry : Keyboard & mouse.
Speed Comparison
Device
P+V(s)
Compare with SP3000U
Type
K8P6415UQB
9.1(P)+2.3(V)= 11.4(s)
25.1(P)+16.8(V)=41.9(s)
64Mb NOR FLASH
AM29DL640G
9.1(P)+2.3(V)= 11.4(s)
38.5(P)+11.8(V)=50.3(s)
64Mb NOR FLASH
K9F1208U0B
35.2(P)+32.2(V)=67.4
188.6(P)+179.2(V)=367.8
512Mb NAND FLASH
KAP21WP00M
53.2(p)+54.8(V)=108
-
1Gb NAND FLASH
K9F1G08U0A
60.4(P)+56.1(V)=116.5
362.3(P)+359.3(v)=721.6
1Gb NAND FLASH
AT28C64B
0.8(P)+0.1(V)= 0.9(s)
1.2(P)+0.8(V)= 2.0(s)
64Kb EEPROM
24AA128
2.7(P)+1.8(V)= 4.5(s)
5.0(P)+4.0(V)= 9.0(s)
128Kb SPI EEPROM
QB25F640S33B60
29.0(P)+14.4(V)= 43.4(s)
55.2(P)+41.4(V)= 96.6(s)
64Mb SPI EEPROM
AT89C55WD
2.5(P)+0.4(V)=2.9(s)
3.3(P)+1.0(V)=4.3(s)
20KB FLASH MCU
ST72F324BK4B5
2.6(P)+1.3(V)=3.9(s)
18(P)+7(V)=25(s)
32KB FLASH MCU
MB89F538
1.21(P)+0.93(V)=2.14(s)
12(P)+6(V)=18(s)
32KB FLASH MCU
Upd78F9234
2.6(P)+1.3(V)=3.9(s)
38(P)+16(V)=54(s)
16KB FLASH MCU
Device Update
XELTEK updates software and device algorithm regularly.
View the latest Device List.
Updates are available by mail at a nominal charge.
XELTEK also adds devices upon customer’s request at its option.
Hardware & Electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
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